Delivering World Class Solutions

What Do We Do?

Sensata Technologies Interconnection is your partner in developing the right solutions for your needs. Moore’s Law continues to be validated as semiconductor companies drive more function in smaller form factors. The back-end packaging and assembly teams support this drive with the development of new package formats for SIP, stacked die and stacked packages. Suppliers of burn-in sockets are challenged to develop sockets for these new packages with higher I/O. Sensata Technologies Interconnection team eliminates the burn-in socket selection process by partnering with our customers to understand their needs and provide the optimal solution.