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Contact UsFeatures
- 0.4mm pitch for large array
- Compression surface mount
- Support up to 34x34 ball matrix
- Z-axis compliant buckling beam, contact provides stable contact performance independent or solder ball height and composition
- Sharpe edge of dual-point contact tip provides high electrical performance, minimizing ball damage
- Staggered fan out footprint for PCB design consideration
- Advanced latching system provide the ability to handle very thin package, limiting package wrap
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Specifications
| Body Materials | PES, PEI, LCP, or Equivalent |
| Contact Material | Beryllium Copper Alloy |
| Contact Plating | Gold |
| Contact Normal Force | 13 gram average |
| Contact Resistance | 200~300 mΩ |
| Capacitance | |
| Temperature Rating | 150°C |
| Durability | 10,000 cycles min. |
