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  • 0.4mm pitch for large array
  • Compression surface mount
  • Support up to 34x34 ball matrix
  • Z-axis compliant buckling beam, contact provides stable contact performance independent or solder ball height and composition
  • Sharpe edge of dual-point contact tip provides high electrical performance, minimizing ball damage
  • Staggered fan out footprint for PCB design consideration
  • Advanced latching system provide the ability to handle very thin package, limiting package wrap



Body Materials PES, PEI, LCP, or Equivalent
Contact Material Beryllium Copper Alloy
Contact Plating Gold
Contact Normal Force 13 gram average
Contact Resistance 200~300 mΩ
Temperature Rating 150°C
Durability 10,000 cycles min.

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